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제품소개 PRODUCT

    Ultra

    SYS-120U-TNR

    X12 Ultra, 12x 2.5” Drives

    Processor Support 3rd Gen Intel® Xeon® Scalable processors Dual Socket LGA-4189 (Socket P+) supported TDP up to 270W; 3 UPI up to 11.2GT/s
    Key Applications • 5G/Telco
    • Application Tier Service Provider
    • HPC
    • Software Defined Storage
    • Virtualization
    • High End Enterprise Server
    • Cloud Computing
    Outstanding Features • Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM)
    • Optimized Cooling with Support up to 270W TDP processors
    • Modular Components for Building Application-Optimized Solutions
    • Hot-swappable hybrid drive bays supporting NVMe, SATA or SAS
    • Flexible onboard networking options
    • Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
    • Configurable number of PCI-E 4.0 expansion slots with support for double-width GPUs and FPGAs.
    Serverboard SUPER● ® X12DPU-6
    Chipset Intel® C621A
    System Memory (Max.) 32 DIMM slots
    UP to 8TB: 32x 256GB DRAM
    UP to 12TB: 16x 256GB DRAM and 16x 512GB PMem
    Intel® Optane™ persistent memory 200 series
    Expansion Slots 2 PCI-E 4.0 x16 FH, 10.5”L slots
    1 PCI-E 4.0 x16 LP slot
    1 PCI-E 4.0 x16 Internal LP slot
    Onboard Storage
    Controller
    Intel® SATA
    Connectivity 2x 10GbE RJ45 with Intel® X710-AT2 (optional)
    2x 10GbE RJ45 and 2x 10GbE SFP+ with Intel®
    X710-TM4 (optional)
    VGA/Audio 1 VGA port
    Management Intel® Node Manager; KVM with dedicated LAN;
    SuperDoctor® 5; Watch Dog; NMI; IPMI 2.0; SPM;
    SSM; SUM; Redfish API
    Drive Bays 12x 2.5” hot-swap NVMe/SATA/SAS drive bays;
    12x 2.5” NVMe hybrid;
    Optional RAID support via RAID controller AOC
    Peripheral Bays None
    Power Supply Redundant 1200W Titanium level (96%)
    Cooling System 8x 4cm heavy duty fan(s)
    Form Factor 1U Rackmount
    Enclosure: 437 x 43 x 739mm (17.2” x 1.7” x 29.1”)
    Package: 605 x 203 x 950mm (23.81” x 7.99” x 37.4”)
    SYS-620U-TNR

    X12 Ultra

    Processor Support 3rd Gen Intel® Xeon® Scalable processors Dual Socket LGA-4189 (Socket P+) supported TDP up to 270W; 3 UPI up to 11.2GT/s
    Key Applications • 5G/Telco
    • Application Tier Service Provider
    • HPC
    • Software Defined Storage
    • Virtualization
    • High End Enterprise Server
    • Cloud Computing
    Outstanding Features • Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM)
    • Optimized Cooling with Support up to 270W TDP processors
    • Modular Components for Building Application-Optimized Solutions
    • Hot-swappable hybrid drive bays supporting NVMe, SATA or SAS
    • Flexible onboard networking options
    • Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
    • Configurable number of PCI-E 4.0 expansion slots with support for
    double-width GPUs and FPGAs.
    Serverboard SUPER● ® X12DPU-6
    Chipset Intel® C621A
    System Memory (Max.) 32 DIMM slots
    UP to 8TB: 32x 256GB DRAM
    UP to 12TB: 16x 256GB DRAM and 16x 512GB PMem
    Intel® Optane™ persistent memory 200 series
    Expansion Slots 1 PCI-E 4.0 x16 FH, 10.5”L slot
    1 PCI-E 4.0 x16 LP slot
    5 PCI-E 4.0 x8 FH, 10.5”L slots (PCI-E 4.0 x16 options available)
    1 PCI-E 4.0 x8 internal LP slot
    Onboard Storage
    Controller
    Intel® SATA
    Connectivity 2x 10GbE RJ45 with Intel® X710-AT2 (optional)
    2x 10GbE RJ45 and 2x 10GbE SFP+ with Intel® X710-TM4 (optional)
    VGA/Audio 1 VGA port
    Management Intel® Node Manager; KVM with dedicated LAN; SuperDoctor® 5; Watch
    Dog; NMI; IPMI 2.0; SPM; SSM; SUM; Redfish API
    Drive Bays 12x 3.5” hot-swap NVMe/SATA/SAS drive bays; 12x 2.5” NVMe hybrid;
    Optional RAID support via RAID controller AOC
    Peripheral Bays None
    Power Supply Redundant 1200W Titanium level (96%)
    Cooling System 4x 8cm heavy duty fan(s)
    Form Factor 2U Rackmount
    Enclosure: 437 x 89 x 723mm (17.2” x 3.5” x 28.46”)
    Package: 605 x 256 x 947mm (23.81” x 10.07” x 37.28”)
    SYS-1029U-TR4

    1U X11 Ultra, 10x 2.5” Drive Bays

    Processor Support 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
    Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
    Key Applications • Virtualization
    • Cloud Computing
    • High End Enterprise Server
    Outstanding Features • 24 DIMM sockets
    • 4 PCI-E Add-on cards
    • 205W CPU support
    • Platinum Level Power Supply
    • 2 SATA DOM support with embedded power
    Serverboard SUPER● ® X11DPU
    Chipset Intel® C621 chipset
    System Memory (Max.)* Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;
    Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
    Expansion Slots 2 PCI-E 3.0 x16 (FH, 10.5”L); 2 PCI-E 3.0 x8 (1 LP, 1 Internal LP)
    Onboard Storage
    Controller
    Intel® C621 SATA controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10;
    Connectivity 4 Gigabit Ethernet; 2 VGA ports (1 rear, 1 onboard) 5 USB 3.0
    ports (2 rear, 2 front, 1 Type A); 1 Serial Port
    VGA/Audio Aspeed AST2500 BMC
    Management Intel® Node Manager, IPMI2.0, KVM with dedicated LAN, NMI,
    SPM, SSM, SUM, SuperDoctor® 5
    Drive Bays 10 hot-swap 2.5” drive support
    Peripheral Bays N/A
    Power Supply 750W Redundant Platinum Level Power Supply
    Cooling System 8 heavy duty fans w/ Optimal Fan Speed Control, 1 Air Shroud
    Form Factor 437 x 43 x 707mm (17.2” x 1.7” x 27.82”)