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제품소개 PRODUCT

    Storage

    SSG-2029P-DN2RR32L

    X11 SuperStorage, Super SBB

    Processor Support 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
    Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
    Key Applications • Corporate Database
    • Lustre
    • HPC
    • Virtualization
    • High Availability Storage Appliance Platform
    • All Flash Storage
    Outstanding Features • Dual Drawer/Tray with a total of 32 NVMe Ruler SSDs
    • IPMI management with dedicated LAN
    • 2000W High Efficiency (96%) Titanium Level Redundant Power Supplies [nid:58
    • NV-DIMM support
    • Shared storage between redundant controllers
    • Node to node heartbeat/ NTB connectivity
    Serverboard SUPER● ® X11DSN-TSq
    Chipset Intel® C627 chipset
    System Memory (Max.)* Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz;
    Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
    Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
    Expansion Slots 2 PCI-E 3.0 x16 Low-profile slots, 1 PCI-E 3.0 x16 SIOM slot from CPU2, x8 signals shared with QAT enabled board per node
    Onboard Storage
    Controller
    N/A
    Connectivity Dual LAN with 10GBase-T with Intel® X772 + PHY Intel® X557; Dual 10G private Ethernet between controller nodesNode to node PCI-E x8 NTB link
    VGA/Audio 1 VGA D-Sub Connector, 1 Aspeed AST2500 BMC
    Management Intel® Node Manager; IPMI (Intelligent Platform Management Interface) v2.0 with KVM support; IPMI2.0; KVM with dedicated
    LAN; NMI; SPM; SSM; SUM; SuperDoctor® 5; Watchdog;
    Drive Bays 32 hot-swappable Intel Ruler NVMe drive bays + 1x M.2 per node
    Peripheral Bays N/A
    Power Supply 2000W Redundant Titanium Level highefficiency power supplies
    Cooling System 6x 6cm counter rotating fans
    Form Factor 2U 17.2” (437mm) x 3.5” (89mm) x 33.3” (846mm)
    SSG-5029P-E1CTR12L

    SuperStorage, UP

    Processor Support Intel Xeon processor scalable family (Platinum, Gold, Silver, Bronze)Intel® Skylake-EP LGA3647 Socket
    Key Applications • Connectivity/Storage Computer Nodes
    • Application and data serving
    • High Availability Storage Appliance Platfor
    Outstanding Features • Broadcom® 3008 controller onboard
    • Remote management via dedicated IPMI BMC
    • 12x 3.5” hot-swap SAS3 drive bays
    Serverboard SUPER● ® X11SPH-nCTF
    Chipset Intel® C622 chipset
    System Memory (Max.)* Up to 8x 288-pin DDR4 DIMM slots
    Up to 1TB ECC 3DS LRDIMM
    Up to 512GB ECC LRDIMM
    Up to 256GB ECC RDIMM
    Expansion Slots 1 PCI-E 3.0 x16 (x16 or x8 ); 1 PCI-E 3.0 x8 (x0 or x8 ); 1 PCI-E 3.0 x8; 1 PCI-E 3.0 x4 (in x8 slot);
    Onboard Storage
    Controller
    Intel® C622 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10; Broadcom® 3008 SW controller for 8 SAS3 (12Gbs) ports; RAID 0,1,10;
    Connectivity N/A
    VGA/Audio 1 VGA
    Management Intel® Node Manager; IPMI2.0; KVM with dedicated LAN; NMI; SPM; SUM; SuperDoctor® 5; Watchdog;
    Drive Bays 12x 3.5” hot-swap SAS/SATA drive bay with SES3 2x 2.5” hot-swap drive bay
    Peripheral Bays N/A
    Power Supply 800W Redundant Power supply
    Cooling System 3x 8cm high-performance PWM fans;
    Form Factor 2U 17.2” (437mm) x 3.5” (89mm) x 25.5” (647mm); Enclosure: 432 x 76 x 635mm (17.2” x 3.5” x 25.6”) Package: 292 x 673 x 864mm (11.5” x 26.5” x 34”) Gross Weight: 58lbs (26.31kg) Net Weight: 34lbs (15.42kg)
    SSG-6019P-ACR12L

    1U SuperStorage

    Processor Support Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
    Key Applications • Corporate Database
    • Data Center
    • Database Processing & Storage
    • Enterprise Server
    • Big Data Analytics
    • Hadoop
    Outstanding Features • Broadcom® 3224 SAS3 IT mode controller
    • 12x 3.5” hot-swap SAS3/SATA3 drive bays
    • 4x 2.5” 7mm hot-swap NVMe/SATA drive bays
    • 160W CPU support
    • Dual 10G BaseT
    • Internal Cable Arm
    Serverboard SUPER● ® X11DDW-NT
    Chipset Intel® C622 chipset
    System Memory(Max.)* Up to Up to 1.5TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 1.5TB 3DS ECC LRDIMM, in 12 DIMM slots
    Expansion Slots 1 PCI-E 3.0 x32 Left Riser Slot, 1 PCI-E 3.0 x16 Right Riser Slot,
    1 PCI-E 3.0 x16 for Add-On-Module (AOM)
    Onboard Storage
    Controller
    Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10;
    Connectivity N/A
    VGA/Audio Aspeed AST2500 BMC
    Management Intel® Node Manager, IPMI2.0, KVM with dedicated LAN, SPM, SSM, SUM, SuperDoctor® 5, Watchdog
    Drive Bays 12x 3.5” hot-swap SAS3/SATA3 drive bays 4x 2.5” hot-swap NVMe/SATA drive bays
    Peripheral Bays N/A
    Power Supply 1U 600W Redundant Single Output Power Supply w/PMBus, short depth, W54.5xL220xH40
    Cooling System 6x 40x40x56mm 20.5K-17.6K RPM Counter-rotating Fan;
    Form Factor 1U 17.6” (447mm) x 1.7” (43mm) x 39.76” (1010mm)